SMB3EZ5.6D5-SMB3EZ200D5 Features
• Glass passivated chip
• Low leakage
• Built-in strain relief
• Low inductance
• High peak reverse power dissipation
• Lead (Pb)-free component
• For use in stabilizing and clipping circuits with high power rating
SMB3EZ5.6D5-SMB3EZ200D5 Mechanical Data
• Case: Molded plastic
• Epoxy: UL 94V-0 rate flame retardant
• Lead: Solderable per MIL-STD-750, Method 2026
• Polarity: Color band denotes cathode end
• Mounting position: Any